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          服務咨詢熱線

          18928287278

          詳細內容
          應用 Application

          紫外激光打標機以其獨 特的小功率激光束為主,適應于精細加工,化妝品包裝、藥品包裝、LCP材料等5G領域電子配件及其他高分子材料的塑膠表面打標,標記清晰牢固。

          With its unique low power laser beam,UV laser marking machine is suitable for the fine processing,Cosmetics packaging,Pharmaceutical Packaging,Electronic accessories in the 5G field such as LCP materials,Pand other polymer materials plastic surface marking,and marking is clear and firm.

          產品參數 Product parameter

           產品型號 Machine model

          LP-UV3W

           機器尺寸 Machine size

          600*790*1410(mm)

           激光功率 Laser power

          3-10W(選配)

          打標范圍 Marking range

          150-200(mm)

          激光波長 Laser wavelength

          355nm

          偏振度Degree of polarization

          >100:1

          光束質量 Beam quality

          M2<1.2

          脈寬 Pulese width

          <20ns

          支持格式 Supported formats

          PLT、BMP、JPG、DXF、CDR、TIFF、TGA、DWG、PCX、GIF

          脈沖穩定性 Pulse stability

          <3%

          重復精度 Repeatability accuracy

          ±0.002(mm)

          功率穩定性 Power stability

          <5%

          光束發散角 Beam divergence angle

          <1.2mrad

          冷卻方式 Cooling method

          水冷 Water-cooling

          打標速度 Print speed

          5000(mm/s)

          工作環境 Working environment

          溫度temperature5-40℃
          濕度humidity10%-90%(無凝水)

          打標深度 Marking depth

          <0.4(mm)

          工作電壓/Working voltage

          單相single-phaseAC220V±10%
          50-60Hz交流電alternating current

          整機重量 Gross weight

          80kg

          整機功率 Overall power

          <1.8kw

          產品優勢 Product description

          可打標金屬和非金屬材料,在流水線上具在線打標的功能,要求高精密度打標。主要針對薄質易碎物品的淺層標記如:光伏太陽能玻璃,LCP材料等5G領域電子配件等。

          It can marking metal and non-metallic materials,On-line marking function on the assembly line,and Requires high precision marking.mainly for the shallow marking of thin and fragile articles,such as photovoltaic solar glass,Electronic accessories in the 5G field such as LCP materials.

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